The recommended land pattern for MFS1/4DCT52R2002F is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
MFS1/4DCT52R2002F is rated for operation up to 150°C, but it's recommended to derate the power rating by 1.25% per degree Celsius above 125°C. It's also important to ensure that the component is properly cooled and that the operating conditions do not exceed the maximum ratings.
To prevent damage, handle the MFS1/4DCT52R2002F by the edges or the body, avoiding touching the terminals or the resistor element. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the component during assembly.
MFS1/4DCT52R2002F is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, the component is moisture-resistant and can withstand normal humidity levels. If you need to use it in a high-humidity environment, consider applying a conformal coating or potting compound to protect the component.
The recommended soldering profile for MFS1/4DCT52R2002F is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation. Avoid using excessive soldering temperatures or times, as this can damage the component.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
MFS1/4DCT52R2002F Overview
Use the download button to access the MFS1/4DCT52R2002F schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MFS1/,
or try a keyword search, such as Metal Film Resistors
