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MFW02-05S05 - Minmax

Description: The MFW02 series is the latest generation of high performance DC-DC converter modules setting a new standard concerning power density. The product offers a full 2W isolated DC-DC converter within an encapsulated DIP-8 package. There are 28 models available for 5, 12, 24, 48VDC input with wide 2:1 input voltage range.

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PCB Footprints
MFW02-05S05 - Minmax PCB footprint - Other - Other - MFW02-05S05-1
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3D Models
MFW02-05S05 - Minmax  - 3D model - Other - MFW02-05S05-1
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MFW02-05S05 Details

  • Manufacturer Part Number:

    MFW02-05S05

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-8/4

  • ECCN Code:

    EAR99

  • Manufacturer:

    Minmax Technology Co Ltd

  • YTEOL:

    5

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    C-UL-US, CB, CE, CUL, EN, IEC, UL

  • Efficiency (Main Output):

    81%

  • Input Voltage-Max:

    10 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    S-PDIP-P4

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Line Regulation-Max:

    0.2%

  • Load Regulation-Max:

    1%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    80 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.4 A

  • Output Voltage-Max:

    5.075 V

  • Output Voltage-Min:

    4.925 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP4/8,.3

  • Package Shape:

    SQUARE

  • Package Style:

    IN-LINE

  • Protections:

    OVER LOAD, SHORT CIRCUIT, UNDER VOLTAGE

  • Ripple Voltage (Main Out):

    0.024745 Vrms

  • Screening Level:

    EN/IEC/UL 62368-1

  • Seated Height-Max:

    8.5 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    PIN/PEG

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Total Power Output-Max:

    2 W

  • Trim/Adjustable Output:

    NO

  • Width:

    14 mm

MFW02-05S05 Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves placing the module on a multi-layer board with a solid ground plane, using thermal vias to dissipate heat, and keeping the surrounding area clear of components. A heat sink or thermal pad can be added on top of the module for improved thermal management.
  • To ensure reliability and longevity, operate the module within the specified temperature range, avoid thermal shocks, and provide adequate cooling. Implementing a temperature monitoring and shutdown mechanism can also help prevent damage from overheating.
  • The module is designed to meet CISPR 22 Class B emissions standards. To minimize EMI and RFI, use a metal shield or enclosure, keep the module away from antennas and high-frequency components, and implement proper grounding and shielding techniques.
  • Yes, the module can be used in a redundant or parallel configuration, but it's essential to ensure proper synchronization, current sharing, and thermal management to avoid overheating and reduce the risk of component failure.
  • The module meets various safety certifications, including UL, CE, and RoHS. Ensure proper handling, installation, and operation to avoid electrical shock, fire hazards, and other safety risks.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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MFW02-05S05 Overview

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