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MGD3160AM315EKR2 - NXP

Description: Gate Drivers EV Inverter Control; IGBT & SiC GDIC

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MGD3160AM315EKR2 - NXP  - 3D model
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MGD3160AM315EKR2 Details

  • Manufacturer Part Number:

    MGD3160AM315EKR2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    11

  • High Side Driver:

    YES

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G32

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP32,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    40 V

  • Supply Voltage-Min:

    4.5 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-on Time:

    0.15 µs

  • Width:

    7.5 mm

MGD3160AM315EKR2 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in the MGD3160 application note (AN11524). It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and electromagnetic compatibility.
  • The optimal timing and dead-time settings depend on the specific application, motor type, and system requirements. NXP recommends using the MGD3160 evaluation board and the accompanying software tools to experiment and find the optimal settings for your application.
  • The MGD3160 is designed for high-voltage and high-current applications, but it's essential to consider the maximum ratings, thermal management, and PCB layout to ensure reliable operation. NXP provides guidelines and recommendations in the datasheet and application notes.
  • NXP recommends using the MGD3160 evaluation board and the accompanying software tools to debug and troubleshoot issues. Additionally, consult the datasheet, application notes, and NXP's technical support resources for guidance on troubleshooting common issues.
  • The MGD3160 is designed to meet various safety and regulatory standards, such as IEC 61508 and ISO 26262. However, it's essential to consider the system-level safety and regulatory requirements, including isolation, insulation, and protection mechanisms, to ensure compliance and safe operation.

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MGD3160AM315EKR2 Overview

Use the download button to access the MGD3160AM315EKR2 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like MGD31, or try a keyword search, such as MOSFET Drivers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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