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MGD3160AM335EK - NXP

Description: Half Bridge Driver General Purpose IGBT 32-SOIC 15A 4.5V ~ 40V-40°C ~ 125°C (TA)

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MGD3160AM335EK - NXP - PCB symbol
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PCB Footprints
MGD3160AM335EK - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT1762-1
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3D Models
MGD3160AM335EK - NXP - 3D model - Small Outline Packages - SOT1762-1
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MGD3160AM335EK Details

  • Manufacturer Part Number:

    MGD3160AM335EK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    11

  • High Side Driver:

    YES

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G32

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP32,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    40 V

  • Supply Voltage-Min:

    4.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-on Time:

    0.15 µs

  • Width:

    7.5 mm

MGD3160AM335EK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in the MGD3160AM335EK application note (AN11524). It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and electromagnetic compatibility (EMC).
  • The MGD3160AM335EK can be configured for different operating modes using the SPI interface. Refer to the device's programming guide (MGD3160AM335EK_PG) for detailed information on register settings and configuration options.
  • NXP recommends using a combination of capacitors, inductors, and resistors for input and output filtering to reduce electromagnetic interference (EMI). The specific component values and configurations can be found in the MGD3160AM335EK application note (AN11524) and the NXP EMI reduction guide.
  • NXP provides a troubleshooting guide (MGD3160AM335EK_TG) that covers common issues, error codes, and debugging techniques. Additionally, engineers can use the NXP development boards and evaluation kits to test and debug their designs.
  • The MGD3160AM335EK has a maximum junction temperature (Tj) of 150°C. Derating factors for temperature, voltage, and current can be found in the device's datasheet and application note (AN11524). It's essential to consider these factors to ensure reliable operation and prevent overheating.

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MGD3160AM335EK Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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