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MGD3160AM515EK - NXP

Description: Gate Drivers EV Inverter Control; IGBT & SiC GDIC

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MGD3160AM515EK - NXP - PCB symbol
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PCB Footprints
MGD3160AM515EK - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT1762-1
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3D Models
MGD3160AM515EK - NXP - 3D model - Small Outline Packages - SOT1762-1
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MGD3160AM515EK Details

  • Manufacturer Part Number:

    MGD3160AM515EK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    11

  • High Side Driver:

    YES

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G32

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP32,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    40 V

  • Supply Voltage-Min:

    4.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-on Time:

    0.15 µs

  • Width:

    7.5 mm

MGD3160AM515EK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in the MGD3160AM515EK application note (AN11535). It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and to prevent overheating.
  • To achieve optimal efficiency and minimal power consumption, configure the device according to the recommended settings in the datasheet and application note. This includes setting the correct output voltage, switching frequency, and enabling power-saving features like pulse-skipping and low-power mode.
  • The critical components and their values for the output filter and input filter are not explicitly stated in the datasheet. However, NXP provides a reference design and bill of materials (BOM) in the MGD3160AM515EK evaluation board documentation, which can be used as a starting point for designing the filters.
  • To troubleshoot and debug issues with the device, use a combination of tools like oscilloscopes, signal generators, and logic analyzers. NXP also provides a troubleshooting guide in the application note, which covers common issues and their solutions.
  • For high-power applications, it's essential to consider thermal design and layout carefully. NXP recommends using a thermal interface material (TIM) between the device and the heat sink, and ensuring good airflow around the device. The application note provides more detailed guidance on thermal design and layout.

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MGD3160AM515EK Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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