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MGFW302412 - Cosel

Description: Cosel 30W Isolated DC-DC Converter, Vin 9 → 36 V, Vout ±12 (+24)V, I/O isolation 1500V

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PCB Footprints
MGFW302412 - Cosel PCB footprint - Other - Other - MGFW302412-3
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3D Models
MGFW302412 - Cosel  - 3D model - Other - MGFW302412-3
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MGFW302412 Details

  • Manufacturer Part Number:

    MGFW302412

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-6

  • ECCN Code:

    EAR99

  • Manufacturer:

    Cosel USA Inc

  • YTEOL:

    7

  • Additional Feature:

    ALSO AVAILABLE WITH -12V OUPUT OR SINGLE 24V OUTPUT

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    UL, C-UL, EN

  • Efficiency (Main Output):

    88%

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    9 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-XDMA-P6

  • Length:

    50.8 mm

  • Line Regulation-Max:

    0.0072%

  • Load Regulation-Max:

    5%

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.25 A

  • Output Voltage-Max:

    12.492 V

  • Output Voltage-Min:

    11.765 V

  • Output Voltage-Nom:

    12 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    260

  • Protections:

    OVER CURRENT, OVER VOLTAGE

  • Ripple Voltage (Main Out):

    0.053025 Vrms

  • Seated Height-Max:

    10.4 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    PIN/PEG

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    15

  • Total Power Output-Max:

    30 W

  • Trim/Adjustable Output:

    NO

  • Warm-up Time:

    0.03 s

  • Width:

    25.4 mm

MGFW302412 Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow a 4-layer PCB stack-up with a dedicated ground plane, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, ensure a minimum of 10mm clearance around the module for airflow and heat dissipation.
  • To ensure EMC, follow proper PCB layout and grounding techniques, and use a metal enclosure with a minimum of 1mm thickness. Ensure that all cables and connectors are properly shielded and filtered. Additionally, consider using a common-mode choke and X-capacitors for additional noise reduction.
  • Derating curves can be obtained from Cosel USA Inc upon request. To apply derating, calculate the maximum operating temperature and output power based on the ambient temperature and airflow. Use the provided curves to determine the maximum allowable output power and adjust the system design accordingly.
  • Implement OCP by using a current sense resistor and a comparator to monitor the output current. For OVP, use a voltage sense resistor and a comparator to monitor the output voltage. Use the module's built-in protection features, such as hiccup mode and auto-restart, to ensure safe operation.
  • Use a pi-filter configuration with a common-mode choke, X-capacitors, and Y-capacitors to reduce electromagnetic interference (EMI). For output filtering, use a LC filter with a minimum of 10uF capacitance and 10uH inductance to reduce output ripple and noise.

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MGFW302412 Overview

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