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MH1608-100Y - Bourns

Description: Ferrite Beads 10 ohms 25% HIGH CURRENT

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PCB Footprints
MH1608-100Y - Bourns PCB footprint - Ferrite Bead Chip - Ferrite Bead Chip - MH1608-100Y
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3D Models
MH1608-100Y - Bourns  - 3D model - Ferrite Bead Chip - MH1608-100Y
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MH1608-100Y Details

  • Manufacturer Part Number:

    MH1608-100Y

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.19

  • Case Code:

    0603

  • Construction:

    Chip Bead

  • DC Resistance-Max:

    0.1 Ω

  • Filter Type:

    FERRITE CHIP

  • Frequency-Max:

    100 MHz

  • Frequency-Min:

    100 MHz

  • Height:

    0.8 mm

  • Insulation Resistance-Min:

    0.1 MΩ

  • JESD-609 Code:

    e3

  • Length:

    1.6 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Impedance:

    10 OHM Ω

  • Packing Method:

    TAPE AND REEL

  • Rated Current:

    6 A

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Width:

    0.8 mm

MH1608-100Y Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a ground plane underneath the device to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
  • Handle the device by the body or the pins, avoiding touching the glass seal or the ceramic substrate. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the leads during assembly.
  • The MH1608-100Y is rated for operation from -40°C to +125°C. However, the device's performance may degrade at extreme temperatures, and derating may be necessary for reliable operation.
  • Yes, the MH1608-100Y is designed to withstand vibrations up to 10 G peak acceleration. However, it's essential to ensure proper mounting and securing of the device to prevent mechanical stress and damage.
  • Use a soft-bristled brush and a mild detergent solution to gently clean the device. Avoid using harsh chemicals, abrasive materials, or ultrasonic cleaning, as they may damage the device or its components.

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MH1608-100Y Overview

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