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MIC2009A-1YM6-TR - Microchip

Description: Power Switch ICs - Power Distribution Adjustable Current Limiting Power Distribution Switch

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Symbol
MIC2009A-1YM6-TR - Microchip - PCB symbol
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PCB Footprints
MIC2009A-1YM6-TR - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 6-Pin SOT23
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3D Models
MIC2009A-1YM6-TR - Microchip - 3D model - SOT23 (6-Pin) - 6-Pin SOT23
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MIC2009A-1YM6-TR Details

  • Manufacturer Part Number:

    MIC2009A-1YM6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LSSOP, TSOP6,.11,37

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT-23-6

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    Adjustable Current Limit

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max (Isup):

    0.3 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

MIC2009A-1YM6-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC2009A-1YM6-TR near a thermal pad or a heat sink, and ensuring good copper pour and thermal vias to dissipate heat efficiently.
  • To ensure reliable operation over the full temperature range, ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal gradients and hotspots.
  • Using a lower input voltage than the recommended 4.5V may affect the device's performance, including reduced output current capability and potentially increased dropout voltage. Consult the datasheet for specific performance characteristics at lower input voltages.
  • Yes, the MIC2009A-1YM6-TR is suitable for high-reliability and automotive applications, but additional testing and validation may be required to ensure compliance with specific industry standards and regulations.
  • To troubleshoot issues with the MIC2009A-1YM6-TR, check the input voltage, output current, and thermal conditions. Verify that the device is operated within the recommended specifications, and check for any signs of physical damage or contamination.

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MIC2009A-1YM6-TR Overview

Use the download button to access the MIC2009A-1YM6-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC20, or try a keyword search, such as Power Management Circuits

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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