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MIC2019YML-TR - Microchip

Description: Power Switch ICs - Power Distribution Programmable Current Limit Single High-Side Switch w/Kickstart + Flag

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Symbol
MIC2019YML-TR - Microchip - PCB symbol
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PCB Footprints
MIC2019YML-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - MIC2019YML-TR
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3D Models
MIC2019YML-TR - Microchip - 3D model - Small Outline No-lead - MIC2019YML-TR
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MIC2019YML-TR Details

  • Manufacturer Part Number:

    MIC2019YML-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    VDFN-6

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    Adjustable Current Limit

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.95 mm

  • Supply Current-Max (Isup):

    0.3 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

MIC2019YML-TR Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended for optimal heat dissipation.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal gradients and hotspots. Additionally, consider using thermal interface materials to improve heat transfer.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potential device failure. It is essential to ensure that the device operates within the recommended temperature range to maintain reliability.
  • Follow standard ESD handling procedures, such as using ESD-safe workstations, wrist straps, and packaging materials. Additionally, consider implementing ESD protection circuits or devices in the system design.
  • For high-frequency operation, ensure that the PCB layout is optimized for minimal parasitic inductance and capacitance. Use controlled impedance lines, and consider using shielding or guard rings to minimize electromagnetic interference.

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MIC2019YML-TR Overview

Use the download button to access the MIC2019YML-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC20, or try a keyword search, such as Power Management Circuits

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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