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MIC2026A-1YM-TR - Microchip

Description: Power Switch ICs - Power Distribution

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MIC2026A-1YM-TR - Microchip - PCB symbol
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PCB Footprints
MIC2026A-1YM-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8 SOIC (M)
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3D Models
MIC2026A-1YM-TR - Microchip - 3D model - Small Outline Packages - 8 SOIC (M)
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MIC2026A-1YM-TR Details

  • Manufacturer Part Number:

    MIC2026A-1YM-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP, SOP8,.25

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.93 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.73 mm

  • Supply Current-Max (Isup):

    0.16 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.45V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.94 mm

MIC2026A-1YM-TR Frequently Asked Questions (FAQs)

  • A good thermal design should be used to minimize thermal resistance. A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The MIC2026A-1YM-TR should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • To ensure reliable operation over the full temperature range, it is essential to follow proper PCB design and layout guidelines, use a suitable thermal design, and ensure that the device is operated within its specified voltage and current ratings.
  • The MIC2026A-1YM-TR is an ESD-sensitive device. Handle the device by the body or the pins, and avoid touching the pins or the die. Use an anti-static wrist strap or mat, and store the device in an anti-static bag or container.
  • Yes, the MIC2026A-1YM-TR is suitable for high-reliability applications. It is manufactured using a high-reliability process, and it has undergone rigorous testing to ensure its quality and reliability.
  • To troubleshoot issues with the MIC2026A-1YM-TR, first, verify that the device is properly powered and that the input voltage is within the specified range. Check for any signs of overheating, and ensure that the device is properly cooled. Use a scope or a logic analyzer to verify the input and output signals.

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MIC2026A-1YM-TR Overview

Use the download button to access the MIC2026A-1YM-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC20, or try a keyword search, such as Power Management Circuits

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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