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MIC2039EYM6-TR - Microchip

Description: Power Switch ICs - Power Distribution ADJ High-Side, Power Distribution Switch

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Symbol
MIC2039EYM6-TR - Microchip - PCB symbol
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PCB Footprints
MIC2039EYM6-TR - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT23-6LD-PL-1
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3D Models
MIC2039EYM6-TR - Microchip - 3D model - SOT23 (6-Pin) - SOT23-6LD-PL-1
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MIC2039EYM6-TR Details

  • Manufacturer Part Number:

    MIC2039EYM6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT-23-6

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max (Isup):

    0.3 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    2.25; 2.15

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.6 mm

MIC2039EYM6-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the MIC2039EYM6-TR involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB, connect it to a heat sink or a metal plate, and ensure good airflow around the device. The thermal pad should be connected to a copper plane on the PCB to dissipate heat efficiently.
  • The recommended input capacitor value for the MIC2039EYM6-TR is 10uF to 22uF, with a voltage rating of 25V or higher. A low-ESR ceramic capacitor, such as an X5R or X7R type, is recommended for optimal performance.
  • To troubleshoot issues with the MIC2039EYM6-TR, start by checking the input voltage, output voltage, and current draw. Verify that the input and output capacitors are properly connected and of the correct value. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to check for any oscillations or noise on the output voltage.
  • Yes, the MIC2039EYM6-TR is suitable for high-reliability and high-temperature applications. It's rated for operation up to 125°C and has a high MTBF (Mean Time Between Failures) rating. However, it's essential to follow proper design and layout guidelines, and to ensure proper thermal management and cooling.

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MIC2039EYM6-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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