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MIC2251-2YD5-TR - Microchip

Description: Microchip MIC2251-2YD5-TR, Boost Converter, Boost 3.5A Adjustable 5-Pin, SOT-23

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PCB Footprints
MIC2251-2YD5-TR - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5 lead sot-23
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3D Models
MIC2251-2YD5-TR - Microchip  - 3D model - SOT23 (5-Pin) - 5 lead sot-23
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MIC2251-2YD5-TR Details

  • Manufacturer Part Number:

    MIC2251-2YD5-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    5

  • Manufacturer Package Code:

    TSOT-5

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE FREQUENCY MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.5 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.6 A

  • Output Voltage-Max:

    37 V

  • Output Voltage-Nom:

    15 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.6 mm

MIC2251-2YD5-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC2251-2YD5-TR near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, keeping the thermal path short and direct can help to reduce thermal resistance.
  • To ensure reliable start-up and shutdown, it is recommended to follow a soft-start sequence, where the input voltage is ramped up slowly to prevent inrush currents. Additionally, a capacitor can be added in parallel with the input voltage to filter out noise and ensure a clean start-up. During shutdown, the input voltage should be ramped down slowly to prevent voltage spikes.
  • To prevent damage, it is recommended to handle the MIC2251-2YD5-TR by the body or the pins, avoiding touching the die or the internal components. Static electricity can also damage the device, so it is recommended to use an anti-static wrist strap or mat when handling the device. Additionally, the device should be stored in an anti-static bag or tube to prevent damage during transportation.
  • To troubleshoot issues with the MIC2251-2YD5-TR, it is recommended to follow a systematic approach, starting with a visual inspection of the PCB and the device for signs of physical damage or overheating. Next, check the input voltage and current, as well as the output voltage and current, to ensure they are within the recommended specifications. If the issue persists, check the PCB layout and thermal design to ensure they are optimal. Finally, consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • When designing a thermal solution for the MIC2251-2YD5-TR, it is important to consider the device's power dissipation, thermal resistance, and junction temperature. A heat sink with a low thermal resistance should be used, and the device should be mounted in a way that ensures good thermal contact. Additionally, the PCB layout should be designed to minimize thermal resistance and ensure good airflow around the device.

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MIC2251-2YD5-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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