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MIC23051-CGYML-TR - Microchip

Description: IC REG BUCK 1.8V 600MA 8MLF

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MIC23051-CGYML-TR Details

  • Manufacturer Part Number:

    MIC23051-CGYML-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    2 X 2 MM, GREEN, MLF-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    VDFN-8

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    24

  • Additional Feature:

    ALSO HAS PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.6 A

  • Output Voltage-Max:

    1.845 V

  • Output Voltage-Min:

    1.755 V

  • Output Voltage-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    4600 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2 mm

MIC23051-CGYML-TR Frequently Asked Questions (FAQs)

  • Microchip recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to minimize thermal resistance. Additionally, placing thermal vias under the IC and using a thermal pad on the bottom of the package can help to dissipate heat more efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to derate the device's power dissipation according to the ambient temperature. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
  • Microchip recommends using a high-quality, low-ESR ceramic capacitor with a value of 10uF to 22uF for the input capacitor. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ensure stable operation.
  • To troubleshoot issues with the output voltage regulation, check the input voltage, output voltage, and feedback voltage to ensure they are within the specified ranges. Also, verify that the feedback resistors are correctly sized and that the output capacitor is of sufficient value and quality. If issues persist, consult the datasheet and application notes for further guidance.
  • The maximum allowable output current for the MIC23051-CGYML-TR is 1.5A. However, the actual output current capability may be limited by the input voltage, output voltage, and thermal conditions. Be sure to check the datasheet and thermal derating curves to ensure the device is operated within its safe operating area.

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MIC23051-CGYML-TR Overview

Use the download button to access the MIC23051-CGYML-TR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC23, or try a keyword search, such as Switching Regulator or Controllers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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