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MIC2536-2YM - Microchip

Description: Power Switch ICs - Power Distribution Dual USB Switch

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PCB Footprints
MIC2536-2YM - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead SOP (M)
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3D Models
MIC2536-2YM - Microchip  - 3D model - Small Outline Packages - 8-Lead SOP (M)
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MIC2536-2YM Details

  • Manufacturer Part Number:

    MIC2536-2YM

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.879 mm

  • Supply Current-Max (Isup):

    0.1 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

MIC2536-2YM Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC2536-2YM near a thermal pad or a heat sink, and ensuring good airflow around the device. The PCB should also have a solid ground plane to help dissipate heat.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design guidelines, such as using a heat sink, ensuring good airflow, and keeping the device within its specified operating temperature range.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and even permanent damage. It's crucial to ensure the device operates within its specified temperature range to maintain reliability and performance.
  • To troubleshoot issues with the MIC2536-2YM, start by checking the power supply, input voltage, and output voltage. Verify that the device is properly soldered and that there are no shorts or opens on the PCB. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • To minimize EMI and RFI, use proper PCB layout techniques, such as separating analog and digital circuits, using shielding, and implementing filtering and decoupling. Follow the recommended layout guidelines in the datasheet and application notes.

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MIC2536-2YM Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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