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MIC2774N-17YM5-TR - Microchip

Description: IC SUPERVISOR 2 CHANNEL SOT23-5

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PCB Footprints
MIC2774N-17YM5-TR - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - MIC1557
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MIC2774N-17YM5-TR - Microchip  - 3D model - SOT23 (5-Pin) - MIC1557
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MIC2774N-17YM5-TR Details

  • Manufacturer Part Number:

    MIC2774N-17YM5-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT-23-5

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max (Vsup):

    1.89 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +1.69V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.6 mm

MIC2774N-17YM5-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its specified temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's crucial to ensure that the device operates within its specified temperature range to maintain reliability and performance.
  • To handle ESD protection, it's recommended to follow proper ESD handling procedures during device handling and assembly. Additionally, consider using ESD protection devices, such as TVS diodes, to protect the MIC2774N-17YM5-TR from electrostatic discharge.
  • When assembling and reworking the PCB, it's essential to follow proper soldering and desoldering techniques to avoid damaging the device. Use a low-temperature soldering process, and avoid applying excessive heat or mechanical stress to the device.

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MIC2774N-17YM5-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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