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MIC2779L-2YM5-TR - Microchip

Description: Supervisor Push-Pull, Totem Pole 2 Channel SOT-23-5

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Symbol
MIC2779L-2YM5-TR - Microchip - PCB symbol
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PCB Footprints
MIC2779L-2YM5-TR - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-Lead SOT23
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MIC2779L-2YM5-TR - Microchip - 3D model - SOT23 (5-Pin) - 5-Lead SOT23
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MIC2779L-2YM5-TR Details

  • Manufacturer Part Number:

    MIC2779L-2YM5-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, SOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT-23-5

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.91 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max (Isup):

    0.002 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.5 V

  • Supply Voltage-Nom (Vsup):

    1.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.625 mm

MIC2779L-2YM5-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC2779L-2YM5-TR near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, keeping the thermal vias small and numerous can help to dissipate heat more efficiently.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence: VCC, then EN, then VIN. Also, make sure to tie the EN pin high to enable the device. Additionally, configure the device according to the datasheet recommendations for the desired output voltage and current limit.
  • Handle the MIC2779L-2YM5-TR with care to prevent damage from electrostatic discharge (ESD). Use an ESD wrist strap or mat, and ensure the workspace is ESD-safe. Avoid touching the device's pins or exposed pads, and use a vacuum pickup or tweezers to handle the device.
  • To troubleshoot issues, start by verifying the power-up sequence and configuration. Check the input voltage, output voltage, and current limit settings. Use an oscilloscope to monitor the output voltage and current. If issues persist, consult the datasheet and application notes for guidance, or contact Microchip's technical support.
  • The MIC2779L-2YM5-TR has a maximum junction temperature (TJ) of 150°C. Ensure good thermal conductivity between the device and the PCB, and consider using a heat sink or thermal pad to dissipate heat. Monitor the device's temperature and adjust the thermal design accordingly to prevent overheating.

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MIC2779L-2YM5-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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