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MIC33M656-SAYMP-TR - Microchip

Description: 6A, Power Module Buck Converter with HyperLight Load® and I2C Interface, 1.0V Output, -40C to +125C Temperature Range, 53-Lead B1QFN Package, Tape and Reel

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MIC33M656-SAYMP-TR - Microchip - PCB symbol
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PCB Footprints
MIC33M656-SAYMP-TR - Microchip PCB footprint - Other - Other - 53-Pin B1QFN
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MIC33M656-SAYMP-TR - Microchip - 3D model - Other - 53-Pin B1QFN
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MIC33M656-SAYMP-TR Details

  • Manufacturer Part Number:

    MIC33M656-SAYMP-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-53

  • Pin Count:

    53

  • Manufacturer Package Code:

    MODULE-53

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2019-09-24

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Additional Feature:

    IT ALSO HAS 0.6 TO 1.28V OUTPUT

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.4 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PQMA-N53

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Number of Functions:

    1

  • Number of Terminals:

    53

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    6 A

  • Output Voltage-Max:

    1.015 V

  • Output Voltage-Min:

    0.985 V

  • Output Voltage-Nom:

    1 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QMA

  • Package Equivalence Code:

    LCC53,.24X.4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    3.05 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2200 kHz

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

MIC33M656-SAYMP-TR Frequently Asked Questions (FAQs)

  • Microchip recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the package to improve thermal dissipation. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the output current and voltage according to the thermal derating curves provided in the datasheet. Additionally, ensure good airflow and thermal management around the device.
  • Microchip recommends using X5R or X7R ceramic capacitors with a minimum capacitance of 10uF for the input and output. The capacitors should be placed as close as possible to the device pins to minimize parasitic inductance.
  • Check the input voltage, output load, and feedback resistors for correct values and connections. Verify that the device is properly soldered and that there are no shorts or opens on the PCB. Use an oscilloscope to check for oscillations or noise on the output voltage.
  • Yes, the MIC33M656-SAYMP-TR can be used in a redundant or parallel configuration to improve system reliability and availability. However, it is recommended to consult with Microchip's application engineers to ensure proper design and implementation.

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MIC33M656-SAYMP-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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