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MIC37100-1.8WS-TR - Microchip

Description: 1.0A Low Voltage uCap LDO Voltage Regulator

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MIC37100-1.8WS-TR - Microchip - PCB symbol
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PCB Footprints
MIC37100-1.8WS-TR - Microchip PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT223-3LD
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MIC37100-1.8WS-TR - Microchip - 3D model - SOT223 (3-Pin) - SOT223-3LD
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MIC37100-1.8WS-TR Details

  • Manufacturer Part Number:

    MIC37100-1.8WS-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-223, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-223-3

  • Country Of Origin:

    Mainland China, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.28 V

  • Input Voltage Absolute-Max:

    6.5 V

  • Input Voltage-Max:

    6 V

  • Input Voltage-Min:

    2.25 V

  • JESD-30 Code:

    R-PSSO-G3

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Line Regulation-Max:

    0.009%

  • Load Regulation-Max:

    0.018%

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    1 A

  • Output Voltage1-Max:

    1.836 V

  • Output Voltage1-Min:

    1.764 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOT-223

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.8 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.3 mm

  • Terminal Position:

    SINGLE

  • Voltage Tolerance-Max:

    2%

  • Width:

    3.5 mm

MIC37100-1.8WS-TR Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to the copper area.
  • To ensure stability, it's essential to follow the recommended component values and layout guidelines in the datasheet. Additionally, a minimum output capacitance of 10uF is recommended, and the output voltage should be decoupled with a 1uF ceramic capacitor. Avoid using long traces and keep the feedback loop as short as possible.
  • The maximum input voltage rating for the MIC37100-1.8WS-TR is 6V. Applying a voltage higher than 6V can damage the device. It's recommended to add input voltage protection, such as a TVS diode, to prevent overvoltage conditions.
  • The MIC37100-1.8WS-TR is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the output current and ensure proper thermal management to prevent overheating.
  • To troubleshoot issues, start by verifying the input voltage, output voltage, and output current. Check the PCB layout and component values against the recommended values in the datasheet. Use an oscilloscope to measure the output voltage and current waveforms. If issues persist, consult the Microchip support team or a qualified engineer for further assistance.

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MIC37100-1.8WS-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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