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MIC38300AHYHL-TR - Microchip

Description: Power Management Modules 3A High Efficiency Low Dropout (HELDO) Regulator

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MIC38300AHYHL-TR Details

  • Manufacturer Part Number:

    MIC38300AHYHL-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFN-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    LQFN-28

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    24

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Technique:

    PULSE FREQUENCY MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PQCC-N28

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    5 V

  • Output Voltage-Min:

    1 V

  • Output Voltage-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC28,.16X.24,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1.55 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Technology:

    HYBRID

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

MIC38300AHYHL-TR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 4-layer PCB with a solid ground plane, and to place thermal vias under the IC to dissipate heat. Additionally, keep the PCB traces as short and wide as possible to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow the recommended operating conditions, use a heat sink if necessary, and ensure good airflow around the device. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature and take corrective action if necessary.
  • The recommended input capacitor is a 10uF ceramic capacitor with a voltage rating of 10V or higher, and the recommended output capacitor is a 22uF ceramic capacitor with a voltage rating of 10V or higher. However, the actual capacitor values may vary depending on the specific application and operating conditions.
  • To troubleshoot issues with the device not turning on or not regulating properly, check the input voltage, output voltage, and enable pin voltage to ensure they are within the recommended operating ranges. Also, check for any short circuits or open circuits on the PCB, and verify that the device is properly soldered and connected.
  • The recommended soldering profile for this device is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. However, it is recommended to follow the soldering profile recommended by the PCB manufacturer and to use a soldering iron with a temperature control to ensure optimal soldering conditions.

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MIC38300AHYHL-TR Overview

Use the download button to access the MIC38300AHYHL-TR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC38, or try a keyword search, such as Switching Regulator or Controllers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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