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MIC39300-2.5BU - Microchip

Description: IC REG LINEAR 2.5V 3A TO263-3

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MIC39300-2.5BU - Microchip PCB footprint - Other - Other - 3-LEAD TO-263 (U)
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MIC39300-2.5BU Details

  • Manufacturer Part Number:

    MIC39300-2.5BU

  • Rohs Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK

  • Package Description:

    TO-263, SMSIP3H,.55TB

  • Pin Count:

    4

  • Reach Compliance Code:

    Not Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.55 V

  • Dropout Voltage1-Nom:

    0.385 V

  • Input Voltage Absolute-Max:

    20 V

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    2.5 V

  • JESD-30 Code:

    R-PSSO-G3

  • JESD-609 Code:

    e0

  • Length:

    10.287 mm

  • Line Regulation-Max:

    0.0125%

  • Load Regulation-Max:

    0.025%

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    3 A

  • Output Voltage1-Max:

    2.55 V

  • Output Voltage1-Min:

    2.45 V

  • Output Voltage1-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-263

  • Package Equivalence Code:

    SMSIP3H,.55TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    4.8006 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Tin/Lead (Sn85Pb15)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    9.144 mm

MIC39300-2.5BU Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC39300-2.5BU near a thermal pad or a heat sink, using a 2-layer or 4-layer board with a solid ground plane, and minimizing the distance between the device and the thermal pad or heat sink.
  • To ensure stable output voltage with varying input voltage, use a high-quality input capacitor with low ESR, ensure the input voltage is within the recommended range, and use a feedback network with a high gain bandwidth product to maintain stability.
  • The maximum output current capability of the MIC39300-2.5BU is 3A, but it's recommended to derate the output current based on the ambient temperature and the device's thermal performance to ensure reliable operation.
  • The MIC39300-2.5BU is rated for operation up to 125°C, but it's essential to consider the device's thermal performance, PCB layout, and heat sinking to ensure reliable operation in high-temperature environments.
  • To troubleshoot output voltage instability or oscillation issues, check the input voltage, output capacitor, and feedback network for proper selection and implementation, and ensure the PCB layout is optimized for minimal noise and parasitic inductance.

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MIC39300-2.5BU Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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