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MIC4681YM-TR - Microchip

Description: Conv DC-DC 4V to 30V Step Down Single-Out 1.25V 1A 8-Pin SOIC N T/R

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MIC4681YM-TR - Microchip - PCB symbol
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PCB Footprints
MIC4681YM-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead SOP (M)
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MIC4681YM-TR - Microchip - 3D model - Small Outline Packages - 8-Lead SOP (M)
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MIC4681YM-TR Details

  • Manufacturer Part Number:

    MIC4681YM-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP, SOP8,.25

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    7

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Input Voltage-Max:

    30 V

  • Input Voltage-Min:

    4 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Min:

    1.25 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.879 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    220 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MIC4681YM-TR Frequently Asked Questions (FAQs)

  • Microchip recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure optimal thermal performance. Additionally, it's recommended to place a thermal pad under the IC to dissipate heat efficiently.
  • The selection of input and output capacitors depends on the specific application requirements. Generally, a 10uF to 22uF ceramic capacitor is recommended for the input capacitor, and a 22uF to 47uF ceramic capacitor is recommended for the output capacitor. The capacitor values should be chosen based on the desired output voltage ripple and transient response.
  • The MIC4681YM-TR can operate in an ambient temperature range of -40°C to +125°C. However, the device's performance and reliability may be affected at extreme temperatures, and it's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance.
  • Yes, MIC4681YM-TR is suitable for high-reliability and automotive applications. It's AEC-Q100 qualified and meets the requirements for automotive and industrial applications. However, it's recommended to consult with Microchip's application engineers to ensure that the device meets the specific requirements of the application.
  • To troubleshoot MIC4681YM-TR, start by verifying the input voltage, output voltage, and current. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to check the output voltage ripple and transient response. If the issue persists, consult Microchip's application notes and technical support resources for further assistance.

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MIC4681YM-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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