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MIC4802YME-TR - Microchip

Description: LED Lighting Drivers 800mA Single Channel WLED Driver w/ Ultrafast PWM Control

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MIC4802YME-TR - Microchip - PCB symbol
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PCB Footprints
MIC4802YME-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-pin ePAD SOIC (ME)_2022
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3D Models
MIC4802YME-TR - Microchip - 3D model - Small Outline Packages - 8-pin ePAD SOIC (ME)_2022
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MIC4802YME-TR Details

  • Manufacturer Part Number:

    MIC4802YME-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HLSOP, SOP8,.25

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.93 mm

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Seated Height-Max:

    1.68 mm

  • Supply Current-Max:

    5.7 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.94 mm

MIC4802YME-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC4802YME-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The PCB should also have sufficient copper area to dissipate heat.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within its specified temperature range, and that the PCB is designed to minimize thermal resistance. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It is essential to ensure that the device operates within its specified temperature range to maintain reliability and performance.
  • To troubleshoot issues with the MIC4802YME-TR, start by verifying that the device is properly powered and that the input voltage is within the specified range. Check for any signs of overheating, and ensure that the device is properly soldered to the PCB. If issues persist, consult the datasheet and application notes for guidance.
  • The MIC4802YME-TR has built-in ESD protection, but it is still essential to follow proper ESD handling procedures during assembly and testing to prevent damage to the device. Ensure that the PCB is designed with ESD protection in mind, and consider using ESD protection devices if necessary.

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MIC4802YME-TR Overview

Use the download button to access the MIC4802YME-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC48, or try a keyword search, such as Display Drivers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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