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MIC4826YMM-TR - Microchip

Description: LED Lighting Drivers

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MIC4826YMM-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-LEAD MSOP (MM)
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MIC4826YMM-TR - Microchip  - 3D model - Small Outline Packages - 8-LEAD MSOP (MM)
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MIC4826YMM-TR Details

  • Manufacturer Part Number:

    MIC4826YMM-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Display Mode:

    SEGMENT

  • Interface IC Type:

    EL DISPLAY DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Digits/Characters:

    4-DIGIT

  • Number of Functions:

    1

  • Number of Segments:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.075 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MIC4826YMM-TR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the IC is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (–40°C to +125°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the output current at high temperatures to prevent overheating.
  • Handle the device by the body, not the leads, to prevent damage. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent ESD damage.
  • Check the input voltage, output load, and PCB layout for any issues. Ensure that the output capacitor is of sufficient value and type. Verify that the feedback network is properly connected and compensated. Consult the datasheet and application notes for guidance on stability analysis and compensation techniques.
  • Use a shielded enclosure and ensure good PCB layout practices, such as separating analog and digital grounds, using decoupling capacitors, and minimizing loop areas. Add EMI filters or common-mode chokes as needed to reduce emissions and susceptibility.

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MIC4826YMM-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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