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MIC5281-3.3YMME-TR - Microchip

Description: Linear Voltage Regulators 120V/25mA Low Iq, High PSRR LDO

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MIC5281-3.3YMME-TR - Microchip - PCB symbol
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PCB Footprints
MIC5281-3.3YMME-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8 PIN EXPOSED PAD MSOP
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MIC5281-3.3YMME-TR - Microchip - 3D model - Small Outline Packages - 8 PIN EXPOSED PAD MSOP
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MIC5281-3.3YMME-TR Details

  • Manufacturer Part Number:

    MIC5281-3.3YMME-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    3 V

  • Dropout Voltage1-Nom:

    2 V

  • Input Voltage Absolute-Max:

    125 V

  • Input Voltage-Max:

    120 V

  • Input Voltage-Min:

    6 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Line Regulation-Max:

    0.0165%

  • Load Regulation-Max:

    0.033%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.025 A

  • Output Voltage1-Max:

    3.465 V

  • Output Voltage1-Min:

    3.135 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.04 mm

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    5%

  • Width:

    3 mm

MIC5281-3.3YMME-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for MIC5281-3.3YMME-TR involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and inductance.
  • To ensure stability, ensure that the output capacitor is within the recommended range, the input voltage is within the specified range, and the device is operated within the recommended temperature range. Also, avoid over-compensating the device, as this can lead to oscillation.
  • The MIC5281-3.3YMME-TR can deliver up to 500mA of output current, but this may vary depending on the input voltage, output voltage, and ambient temperature. It's recommended to check the datasheet for specific current limits and thermal derating.
  • The MIC5281-3.3YMME-TR is rated for operation up to 125°C, but the device's performance and reliability may degrade at high temperatures. It's recommended to check the datasheet for thermal derating and to consider using a heat sink or other thermal management techniques if operating in high-temperature environments.
  • To troubleshoot issues with the MIC5281-3.3YMME-TR, check the input voltage, output voltage, and output current to ensure they are within the recommended ranges. Also, verify that the device is properly soldered and that the PCB layout is correct. If issues persist, consult the datasheet and application notes for troubleshooting guides.

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MIC5281-3.3YMME-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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