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MIC5282YMME - Microchip

Description: LDO Voltage Regulators 120V/50mA Low Iq, High PSRR LDO

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MIC5282YMME - Microchip - PCB symbol
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PCB Footprints
MIC5282YMME - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Exposed Pad (ePad) MSOP
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MIC5282YMME - Microchip - 3D model - Small Outline Packages - 8-Pin Exposed Pad (ePad) MSOP
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MIC5282YMME Details

  • Manufacturer Part Number:

    MIC5282YMME

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    15

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Nom:

    2 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max (%/V):

    0.5

  • Load Regulation-Max(%):

    1%

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.05 A

  • Output Voltage1-Max:

    5.5 V

  • Output Voltage1-Min:

    1.27 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR

  • Seated Height-Max:

    1.04 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

MIC5282YMME Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias under the package, and a heat sink if possible. The datasheet provides some guidelines, but a more detailed application note is available on Microchip's website.
  • In addition to following the recommended PCB layout, ensure that the device is operated within its specified temperature range (–40°C to +125°C). Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The datasheet specifies the maximum current rating for each output pin. However, it's essential to consider the total current drawn from the device and ensure it does not exceed the recommended maximum current rating to prevent overheating.
  • Start by reviewing the datasheet and application notes for common pitfalls and troubleshooting guidelines. Use oscilloscopes and logic analyzers to debug the circuit, and consider using Microchip's development boards and software tools for more in-depth analysis.
  • Yes, the MIC5282YMME is a high-frequency device, and proper EMI/EMC design practices are crucial. Ensure proper shielding, use of bypass capacitors, and follow the recommended PCB layout guidelines to minimize EMI/EMC issues.

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MIC5282YMME Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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