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MIC5303-2.6YMT-TR - Microchip

Description: IC REG LINEAR 2.6V 300MA 4TMLF

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MIC5303-2.6YMT-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 4-PIN THIN MLF (MT)-ren1
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MIC5303-2.6YMT-TR - Microchip  - 3D model - Small Outline No-lead - 4-PIN THIN MLF (MT)-ren1
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MIC5303-2.6YMT-TR Details

  • Manufacturer Part Number:

    MIC5303-2.6YMT-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    1.20 X 1.60 MM, ROHS COMPLIANT, MLF-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    UDFN-4

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    25

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.2 V

  • Dropout Voltage1-Nom:

    0.1 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.6 V

  • JESD-30 Code:

    R-PDSO-N4

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Line Regulation-Max:

    0.02964%

  • Load Regulation-Max:

    0.052%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    2.678 V

  • Output Voltage1-Min:

    2.522 V

  • Output Voltage1-Nom:

    2.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC4,.05,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.6 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    3%

  • Width:

    1.2 mm

MIC5303-2.6YMT-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for MIC5303-2.6YMT-TR involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and EMI. A 4-layer PCB with a dedicated power plane is recommended.
  • To ensure stability, make sure to follow the recommended output capacitor selection and layout guidelines. A minimum output capacitance of 10uF with an ESR of 0.1 ohms or less is recommended. Additionally, ensure that the input voltage is within the specified range and the device is operated within its recommended operating conditions.
  • The MIC5303-2.6YMT-TR has an operating ambient temperature range of -40°C to +125°C. However, the device's performance and reliability may degrade at extreme temperatures. It's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance.
  • Yes, the MIC5303-2.6YMT-TR is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q100 Grade 1, which ensures the device can operate reliably in harsh environments. However, it's essential to follow the recommended operating conditions, PCB layout, and design guidelines to ensure the device meets the required reliability and performance standards.
  • The power dissipation of MIC5303-2.6YMT-TR can be calculated using the formula: Pd = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current. The device's thermal resistance (θJA) is 42°C/W, which can be used to calculate the junction temperature.

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MIC5303-2.6YMT-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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