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MIC5356-MGYML-TR - Microchip

Description: LDO Voltage Regulators Dual 500mA uCap Low Dropout, Micropower Linear Regulator w/ Active Pull-Down

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MIC5356-MGYML-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-Pin ePad 3mm x 3mm MLF (ML)
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MIC5356-MGYML-TR - Microchip  - 3D model - Small Outline No-lead - 8-Pin ePad 3mm x 3mm MLF (ML)
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MIC5356-MGYML-TR Details

  • Manufacturer Part Number:

    MIC5356-MGYML-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MLF-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    VDFN-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.8 V

  • Dropout Voltage1-Nom:

    0.35 V

  • Dropout Voltage2-Max:

    0.8 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.8 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Line Regulation-Max:

    0.01428%

  • Load Regulation-Max:

    0.028%

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Current2-Max:

    0.5 A

  • Output Voltage1-Max:

    2.884 V

  • Output Voltage1-Min:

    2.716 V

  • Output Voltage1-Nom:

    2.8 V

  • Output Voltage2-Max:

    1.854 V

  • Output Voltage2-Min:

    1.746 V

  • Output Voltage2-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.11,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Regulator Type:

    FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    3%

  • Width:

    3 mm

MIC5356-MGYML-TR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 4-layer PCB with a solid ground plane, and to place thermal vias under the package to dissipate heat. Additionally, keep the PCB traces as short and wide as possible to reduce thermal resistance.
  • To ensure stability and prevent oscillations, it is recommended to use a minimum output capacitance of 10uF, and to add a 1nF to 10nF ceramic capacitor in parallel with the output capacitor to filter out high-frequency noise. Additionally, ensure that the input and output capacitors are placed close to the device and connected with short, wide traces.
  • The maximum input voltage that can be applied to the MIC5356-MGYML-TR is 6V. Exceeding this voltage may cause damage to the device or affect its performance.
  • The output voltage ripple and noise can be calculated using the following formula: ΔVout = (Iout * Rds(on) * fsw) / (Cout * Vout), where Iout is the output current, Rds(on) is the on-resistance of the internal FET, fsw is the switching frequency, Cout is the output capacitance, and Vout is the output voltage.
  • The recommended input capacitor type is a ceramic capacitor with an X5R or X7R dielectric, and a value of 4.7uF to 10uF. This type of capacitor provides low ESR and high ripple current capability, which is suitable for the high-frequency switching of the MIC5356-MGYML-TR.

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MIC5356-MGYML-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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