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MIC5392-MGYMT-TR - Microchip

Description: LDO Voltage Regulators

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MIC5392-MGYMT-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - TDFN
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MIC5392-MGYMT-TR - Microchip  - 3D model - Small Outline No-lead - TDFN
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MIC5392-MGYMT-TR Details

  • Manufacturer Part Number:

    MIC5392-MGYMT-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Pin Count:

    6

  • Manufacturer Package Code:

    UDFN-6

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.31 V

  • Dropout Voltage1-Nom:

    0.155 V

  • Dropout Voltage2-Max:

    0.31 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.8 V

  • JESD-30 Code:

    S-XDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1.2 mm

  • Line Regulation-Max:

    0.01428%

  • Load Regulation-Max(%):

    0.028%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Current2-Max:

    0.15 A

  • Output Voltage1-Max:

    2.884 V

  • Output Voltage1-Min:

    2.716 V

  • Output Voltage1-Nom:

    2.8 V

  • Output Voltage2-Max:

    1.854 V

  • Output Voltage2-Min:

    1.746 V

  • Output Voltage2-Nom:

    1.8 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC5,.047,16

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Regulator Type:

    FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.6 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    3%

  • Width:

    1.2 mm

MIC5392-MGYMT-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC5392-MGYMT-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The PCB should also have sufficient copper area to dissipate heat.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of bridging or cold joints.
  • To prevent ESD damage, handle the MIC5392-MGYMT-TR in an ESD-protected environment, wear an ESD wrist strap or use an ESD mat, and avoid touching the device's pins or leads.
  • To troubleshoot issues with the MIC5392-MGYMT-TR, check the input voltage, output voltage, and current draw. Verify that the device is properly soldered and that the PCB layout is correct. Use an oscilloscope to check for voltage ripple or oscillations.
  • Thermal design considerations for the MIC5392-MGYMT-TR include ensuring good airflow around the device, using a heat sink or thermal pad, and minimizing the thermal resistance between the device and the PCB.

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MIC5392-MGYMT-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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