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MIC6315-29D3UY-TR - Microchip

Description: Microchip Technology MIC6315-29D3UY-TR, Reset Circuit 2.93V max., Reset Input 4-Pin, SOT-143

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MIC6315-29D3UY-TR - Microchip PCB footprint - Other - Other - MIC6315-29D3UY-TR-2
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MIC6315-29D3UY-TR Details

  • Manufacturer Part Number:

    MIC6315-29D3UY-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT-143-4

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    10

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e4

  • Length:

    2.86 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-253

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.015 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.9 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.93V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.3 mm

MIC6315-29D3UY-TR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the IC is recommended for optimal thermal performance. The datasheet provides a recommended PCB layout, but it's essential to consult with a thermal expert or use thermal simulation tools to ensure optimal design.
  • To ensure reliable start-up and shutdown, it's crucial to follow the recommended power-up and power-down sequencing, as outlined in the datasheet. Additionally, ensure that the input voltage rises and falls monotonically, and that the input capacitance is sufficient to filter out noise and ripple.
  • Operating the MIC6315-29D3UY-TR at high ambient temperatures can reduce its reliability and lifespan. It's essential to derate the device's power dissipation and ensure adequate cooling to prevent overheating. Consult the datasheet for thermal derating curves and guidelines for high-temperature operation.
  • To troubleshoot issues with the MIC6315-29D3UY-TR, start by verifying the input voltage, output voltage, and current. Check for proper PCB layout, decoupling, and filtering. Use an oscilloscope to inspect the output voltage and current waveforms. Consult the datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.
  • Yes, the MIC6315-29D3UY-TR can be used in redundant or parallel configurations for high-availability applications. However, it's essential to ensure that the devices are properly synchronized and that the system is designed to handle the increased power dissipation and thermal requirements. Consult the datasheet and application notes for guidelines on redundant and parallel configurations.

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MIC6315-29D3UY-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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