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MIC68200-3.3YML-TR - Microchip

Description: LDO Voltage Regulators 2A Peak FPGA/CPLD LDO with POR, Ramp Control, and Sequencing

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MIC68200-3.3YML-TR Details

  • Manufacturer Part Number:

    MIC68200-3.3YML-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    10

  • Manufacturer Package Code:

    VDFN-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.6 V

  • Dropout Voltage1-Nom:

    0.3 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Line Regulation-Max:

    0.5%

  • Load Regulation-Max:

    0.033%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    10

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    2 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC10,.11,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tolerance-Max:

    2%

  • Width:

    3 mm

MIC68200-3.3YML-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC68200-3.3YML-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed layout recommendation can be found in Microchip's application notes.
  • To ensure the output voltage is stable and accurate, it's essential to follow the recommended capacitor selection and placement guidelines in the datasheet. Additionally, ensure that the input voltage is within the specified range, and the output is properly decoupled with a capacitor.
  • While the datasheet specifies an operating temperature range of -40°C to +125°C, the maximum ambient temperature for reliable operation depends on the specific application and thermal design. As a general guideline, it's recommended to keep the ambient temperature below 85°C for optimal reliability.
  • Yes, the MIC68200-3.3YML-TR is designed to operate in high-vibration environments. However, it's essential to ensure the device is properly mounted and secured to the PCB to prevent mechanical stress and damage.
  • To troubleshoot output voltage deviations or instability, check the input voltage, output capacitor selection, and PCB layout. Ensure that the input voltage is within the specified range, and the output capacitor is properly selected and placed. Also, verify that the device is not overheating and that the thermal design is adequate.

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MIC68200-3.3YML-TR Overview

Use the download button to access the MIC68200-3.3YML-TR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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