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MIC7122YMM-TR - Microchip

Description: Operational Amplifiers - Op Amps

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MIC7122YMM-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead MSOP
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MIC7122YMM-TR - Microchip  - 3D model - Small Outline Packages - 8-Lead MSOP
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MIC7122YMM-TR Details

  • Manufacturer Part Number:

    MIC7122YMM-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0005 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    75 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    9000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.09 mm

  • Slew Rate-Nom:

    0.6 V/us

  • Supply Current-Max:

    2 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    465

  • Wideband:

    NO

  • Width:

    3 mm

MIC7122YMM-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC7122YMM-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The PCB should also have sufficient copper area to dissipate heat.
  • To ensure reliable operation at high temperatures, ensure that the MIC7122YMM-TR is operated within its specified temperature range (–40°C to +125°C). Also, follow proper PCB design and layout guidelines, and ensure good thermal management.
  • Handle the MIC7122YMM-TR by the body, not the leads, to prevent damage. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. Avoid touching the device's pins or exposed internal components.
  • Yes, the MIC7122YMM-TR is designed to operate in high-vibration environments. However, ensure that the device is properly secured to the PCB and that the PCB is designed to withstand the vibration levels.
  • To troubleshoot issues with the MIC7122YMM-TR, start by checking the power supply voltage, input signals, and output loads. Verify that the device is properly configured and that the PCB is free from defects or damage.

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MIC7122YMM-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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