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MIC841HYC5-TR - Microchip

Description: Microchip MIC841HYC5-TR Dual Comparator, Open Drain, Push-Pull O/P, 12μs 1.5 → 5.5 V 5-Pin SC-70

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Symbol
MIC841HYC5-TR - Microchip - PCB symbol
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PCB Footprints
MIC841HYC5-TR - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SC70–5 (C5)
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3D Models
MIC841HYC5-TR - Microchip - 3D model - SOT23 (5-Pin) - SC70–5 (C5)
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MIC841HYC5-TR Details

  • Manufacturer Part Number:

    MIC841HYC5-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-70, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SC70-5

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    6

  • Amplifier Type:

    COMPARATOR

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.02 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    12000 ns

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.25 mm

MIC841HYC5-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, make sure to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Also, consider using a heat sink if the device is expected to operate at high temperatures for extended periods.
  • When handling the MIC841HYC5-TR, take precautions to prevent electrostatic discharge (ESD) damage. Use an ESD wrist strap or mat, and handle the device by the body or pins, not the leads. Also, avoid touching the device's electrical contacts.
  • To troubleshoot issues with the MIC841HYC5-TR, start by checking the power supply voltage, input/output connections, and PCB layout. Use an oscilloscope to check the output voltage and current. Consult the datasheet and application notes for troubleshooting guidelines.
  • For high-reliability applications, consider using a redundant design, implementing fault detection and correction mechanisms, and using a suitable thermal design. Also, ensure that the device is operated within its recommended specifications and that the PCB is designed for high reliability.

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MIC841HYC5-TR Overview

Use the download button to access the MIC841HYC5-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC84, or try a keyword search, such as Comparators

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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