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MIC842NYC5-TR - Microchip

Description: Analog Comparators 1.5uA Undervoltage Comparator w/ 1.25% 1.24V Reference, 20mV Hysteresis, Active-

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Symbol
MIC842NYC5-TR - Microchip - PCB symbol
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PCB Footprints
MIC842NYC5-TR - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-Pin SC-70 (C5)
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3D Models
MIC842NYC5-TR - Microchip - 3D model - SOT23 (5-Pin) - 5-Pin SC-70 (C5)
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MIC842NYC5-TR Details

  • Manufacturer Part Number:

    MIC842NYC5-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-70, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SC70-5

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    COMPARATOR

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.02 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    12000 ns

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.25 mm

MIC842NYC5-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its specified temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • The MIC842NYC5-TR has built-in ESD protection, but it's still important to follow proper ESD handling and storage procedures to prevent damage. Use ESD-safe materials, handle the device by the body, and avoid touching the pins or die.
  • Yes, the MIC842NYC5-TR is suitable for high-reliability and automotive applications. It's AEC-Q100 qualified and meets the requirements for automotive applications. However, it's essential to follow the recommended design and layout guidelines to ensure reliable operation.
  • To troubleshoot issues with the MIC842NYC5-TR, start by reviewing the datasheet and application notes to ensure that the device is used within its specified operating conditions. Check the power supply, input voltage, and output current to ensure they are within the recommended ranges. Use oscilloscopes or logic analyzers to monitor the device's behavior and identify any anomalies.

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MIC842NYC5-TR Overview

Use the download button to access the MIC842NYC5-TR schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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