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MIC94051YM4-TR - Microchip

Description: MOSFET 1.8V-rated reverse-blocking PFET

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MIC94051YM4-TR - Microchip PCB footprint - Other - Other - MIC94051YM4-TR-3
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MIC94051YM4-TR - Microchip  - 3D model - Other - MIC94051YM4-TR-3
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MIC94051YM4-TR Details

  • Manufacturer Part Number:

    MIC94051YM4-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC PACKAGE-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT-143-4

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Case Connection:

    SUBSTRATE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • DS Breakdown Voltage-Min:

    6 V

  • Drain Current-Max (ID):

    1.8 A

  • Drain-source On Resistance-Max:

    0.32 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    0.568 W

  • Power Dissipation-Max (Abs):

    0.568 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MIC94051YM4-TR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer, and to place thermal vias under the IC to dissipate heat. Additionally, keep the PCB traces as short and wide as possible to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, and to consider using thermal interface materials (TIMs) to improve heat transfer between the IC and the heat sink. Additionally, ensure that the IC is operated within its specified temperature range and that the system is designed to handle thermal stress.
  • The recommended input capacitors for the MIC94051YM4-TR are 10uF to 22uF X7R or X5R ceramic capacitors, and the recommended output capacitors are 10uF to 47uF X7R or X5R ceramic capacitors. The capacitor values may vary depending on the specific application and operating conditions.
  • To troubleshoot issues with the device not turning on or not regulating properly, check the input voltage, output voltage, and enable pin voltage to ensure they are within the specified ranges. Also, verify that the input and output capacitors are properly connected and meet the recommended specifications. If the issue persists, check for any signs of overheating or physical damage to the device.
  • Yes, the MIC94051YM4-TR can be used in battery-powered applications. However, it is recommended to consider the device's quiescent current and shutdown current to ensure that the battery life meets the system requirements. Additionally, consider using power-saving modes or low-power modes to minimize power consumption.

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MIC94051YM4-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Small Signal Field-Effect Transistor, 1.8A I(D), 6V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET