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MIC94053YC6-TR - Microchip

Description: MOSFET 1.8V-rated PFET w/Vgs pull-up

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MIC94053YC6-TR - Microchip - PCB symbol
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PCB Footprints
MIC94053YC6-TR - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-70 (C6)
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3D Models
MIC94053YC6-TR - Microchip - 3D model - SOT23 (6-Pin) - SC-70 (C6)
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MIC94053YC6-TR Details

  • Manufacturer Part Number:

    MIC94053YC6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    SC70-6

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • DS Breakdown Voltage-Min:

    6 V

  • Drain Current-Max (ID):

    2 A

  • Drain-source On Resistance-Max:

    0.18 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.27 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MIC94053YC6-TR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The MIC94053YC6-TR should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended operating temperature range (–40°C to +125°C). Also, follow proper PCB design and layout guidelines, and provide adequate heat sinking and thermal management.
  • The MIC94053YC6-TR has built-in ESD protection diodes on all pins. However, it is still recommended to follow proper ESD handling and storage procedures to prevent damage. Additionally, the device is designed to prevent latch-up, but it is still important to follow proper power-up and power-down sequencing to prevent latch-up conditions.
  • The MIC94053YC6-TR is a commercial-grade device, but it can be used in high-reliability or aerospace applications with proper qualification and testing. It is recommended to consult with Microchip Technology Inc. for specific requirements and guidelines for these applications.
  • The recommended soldering conditions for the MIC94053YC6-TR are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering iron temperature of 350°C. For rework, use a low-temperature soldering iron and follow proper rework procedures to prevent damage to the device.

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MIC94053YC6-TR Overview

Use the download button to access the MIC94053YC6-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC94, or try a keyword search, such as Small Signal Field-Effect Transistors

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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