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MIC94060YC6-TR - Microchip

Description: Power Switch ICs - Power Distribution Loadswitch w/level-shift

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MIC94060YC6-TR - Microchip - PCB symbol
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MIC94060YC6-TR - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 6-PIN SC-70
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MIC94060YC6-TR - Microchip - 3D model - Small Outline Packages - 6-PIN SC-70
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MIC94060YC6-TR Details

  • Manufacturer Part Number:

    MIC94060YC6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP,

  • Pin Count:

    6

  • Manufacturer Package Code:

    SC70-6

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Built-in Protections:

    TRANSIENT

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    1.5 µs

  • Turn-on Time:

    0.2 µs

  • Width:

    1.25 mm

MIC94060YC6-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC94060YC6-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The PCB should also have sufficient copper area to dissipate heat.
  • To ensure reliable operation over the full temperature range, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly soldered and connected.
  • To mitigate EMI and RFI, use a multi-layer PCB with a solid ground plane, keep sensitive signals away from the MIC94060YC6-TR, and use shielding or filtering on input/output lines. Additionally, ensure that the device is properly decoupled and bypassed.
  • To troubleshoot issues with the MIC94060YC6-TR, start by checking the power supply voltage, ensuring that it's within the recommended range. Then, verify that the input and output signals are within the specified limits. Use an oscilloscope to check for signal integrity and noise. If issues persist, consult the datasheet and application notes for guidance.
  • Operating the MIC94060YC6-TR beyond its recommended specifications can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to operate the device within its specified limits to ensure reliable operation and prevent damage.

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MIC94060YC6-TR Overview

Use the download button to access the MIC94060YC6-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC94, or try a keyword search, such as Power Management Circuits

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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