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MIC94061YC6-TR - Microchip

Description: Microchip MIC94061YC6-TR, Power Multiplexer 5.5 V max. 6-Pin, SC-70

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MIC94061YC6-TR - Microchip - PCB symbol
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PCB Footprints
MIC94061YC6-TR - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 6 pin sc-70 (C6)
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MIC94061YC6-TR - Microchip - 3D model - SOT23 (6-Pin) - 6 pin sc-70 (C6)
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MIC94061YC6-TR Details

  • Manufacturer Part Number:

    MIC94061YC6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, SC-70, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SC70-6

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Built-in Protections:

    TRANSIENT

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    1.5 µs

  • Turn-on Time:

    0.2 µs

  • Width:

    1.25 mm

MIC94061YC6-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, make sure to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Also, consider using a heat sink if the device is expected to operate at high temperatures for extended periods.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and even permanent damage to the device. It's essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To troubleshoot issues with the MIC94061YC6-TR, start by checking the power supply voltage, input signals, and output loads. Verify that the device is properly soldered and that there are no signs of physical damage. Use oscilloscopes or logic analyzers to debug the signals and identify the root cause of the issue.
  • To prevent electrostatic discharge (ESD) damage, handle the MIC94061YC6-TR with an anti-static wrist strap or mat, and ensure that the workspace is ESD-safe. Avoid touching the device's pins or exposed pads, and use ESD-safe packaging materials during storage and transportation.

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MIC94061YC6-TR Overview

Use the download button to access the MIC94061YC6-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC94, or try a keyword search, such as Peripheral Drivers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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