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MIC94062YC6-TR - Microchip

Description: Power Switch ICs - Power Distribution High Side Power Switch

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MIC94062YC6-TR - Microchip - PCB symbol
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PCB Footprints
MIC94062YC6-TR - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 6 pin sc-70 (C6)
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3D Models
MIC94062YC6-TR - Microchip - 3D model - SOT23 (6-Pin) - 6 pin sc-70 (C6)
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MIC94062YC6-TR Details

  • Manufacturer Part Number:

    MIC94062YC6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, SC-70, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SC70-6

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Built-in Protections:

    TRANSIENT

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    1200 µs

  • Turn-on Time:

    0.2 µs

  • Width:

    1.25 mm

MIC94062YC6-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, make sure to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Also, consider using a heat sink if the device is expected to operate at high temperatures for extended periods.
  • The MIC94062YC6-TR has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the MIC94062YC6-TR is designed to operate in high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure the device is securely attached to the PCB. Additionally, consider using a vibration-dampening material or a shock-absorbing mount to minimize the effects of vibration.
  • To troubleshoot issues with the MIC94062YC6-TR, start by checking the power supply voltage, input signals, and output loads. Use an oscilloscope to verify the input and output waveforms, and check for any signs of overheating or physical damage. Consult the datasheet and application notes for troubleshooting guides and FAQs.

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MIC94062YC6-TR Overview

Use the download button to access the MIC94062YC6-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC94, or try a keyword search, such as Power Management Circuits

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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