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MIC94067YML-TR - Microchip

Description: Power Switch ICs - Power Distribution High Side Power Switch

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Symbol
MIC94067YML-TR - Microchip - PCB symbol
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PCB Footprints
MIC94067YML-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 2x2 mm MLF1
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3D Models
MIC94067YML-TR - Microchip - 3D model - Small Outline No-lead - 2x2 mm MLF1
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MIC94067YML-TR Details

  • Manufacturer Part Number:

    MIC94067YML-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VSON, SOLCC8,.08,20

  • Pin Count:

    8

  • Manufacturer Package Code:

    VDFN-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.95 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2 mm

MIC94067YML-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation across the entire operating temperature range, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal management strategy, and ensure that the device is operated within its specified voltage and current ratings.
  • For EMI and EMC compliance, it's crucial to follow proper PCB design and layout guidelines, use shielding and filtering techniques, and ensure that the device is operated within its specified frequency range. Additionally, using a common-mode choke and a ferrite bead can help reduce EMI emissions.
  • To troubleshoot issues with the MIC94067YML-TR, start by checking the power supply voltage, input/output signals, and PCB layout. Use an oscilloscope to verify signal integrity and check for any signs of overheating or electrical overstress. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Operating the MIC94067YML-TR at high ambient temperatures can reduce its reliability and lifespan. It's essential to ensure proper thermal management, such as using a heat sink or thermal interface material, to maintain a safe junction temperature.

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MIC94067YML-TR Overview

Use the download button to access the MIC94067YML-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC94, or try a keyword search, such as Power Management Circuits

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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