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MIC94070YC6-TR - Microchip

Description: Power Switch ICs - Power Distribution High-Side Load Switch 1.2A, 150mOhm

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PCB Footprints
MIC94070YC6-TR - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-70-6
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3D Models
MIC94070YC6-TR - Microchip  - 3D model - SOT23 (6-Pin) - SC-70-6
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MIC94070YC6-TR Details

  • Manufacturer Part Number:

    MIC94070YC6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    SC70-6

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.005 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.25 mm

MIC94070YC6-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the MIC94070YC6-TR near a thermal pad or a heat sink, and ensuring good airflow around the device. The PCB should also have sufficient copper area to dissipate heat.
  • To ensure reliable operation over the full temperature range, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly soldered and connected.
  • To mitigate EMI and RFI, use proper shielding, grounding, and filtering techniques. Ensure that the PCB layout is designed to minimize radiation and susceptibility, and use EMI filters or chokes as needed.
  • To troubleshoot issues with the MIC94070YC6-TR, start by checking the power supply voltage, input/output connections, and PCB layout. Use oscilloscopes or logic analyzers to debug the signal waveforms and identify potential issues.
  • Operating the MIC94070YC6-TR beyond its recommended specifications can lead to reduced reliability, decreased performance, and potential damage to the device. It's essential to operate the device within its recommended specifications to ensure reliable operation.

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MIC94070YC6-TR Overview

Use the download button to access the MIC94070YC6-TR schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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