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MIC94072YC6-TR - Microchip

Description: Power Switch ICs - Power Distribution

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MIC94072YC6-TR - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - MIC94072YC6-TR
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MIC94072YC6-TR - Microchip  - 3D model - SOT23 (6-Pin) - MIC94072YC6-TR
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MIC94072YC6-TR Details

  • Manufacturer Part Number:

    MIC94072YC6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    SC70-6

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.005 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.25 mm

MIC94072YC6-TR Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink if necessary. The datasheet provides some guidelines, but a more detailed application note or a thermal simulation can provide more specific guidance.
  • In addition to following the recommended operating conditions, ensure that the device is properly decoupled, and the PCB is designed to minimize thermal gradients. Also, consider using a temperature sensor to monitor the device temperature and take corrective action if necessary.
  • Operating at the maximum current rating can reduce the device's lifespan and increase the risk of thermal runaway. It's essential to consider the device's power dissipation, thermal resistance, and the PCB's thermal design to ensure reliable operation.
  • Use a systematic approach to troubleshoot, starting with a review of the device's operating conditions, power supply, and PCB design. Use oscilloscopes, logic analyzers, or other diagnostic tools to identify the root cause of the issue. Consult the datasheet, application notes, and Microchip's technical support resources for guidance.
  • The MIC94072YC6-TR has built-in ESD protection, but it's still essential to follow proper handling and storage procedures to prevent damage. For latch-up prevention, ensure that the device is properly powered up and down, and that the input and output pins are not subjected to excessive voltage or current.

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MIC94072YC6-TR Overview

Use the download button to access the MIC94072YC6-TR schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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