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MIC94073YMT-TR - Microchip

Description: Power Switch ICs - Power Distribution High-Side Load Switch 1.2A, 150mOhm

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PCB Footprints
MIC94073YMT-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 4-PIN THIN MLF (MT)-ren1
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3D Models
MIC94073YMT-TR - Microchip  - 3D model - Small Outline No-lead - 4-PIN THIN MLF (MT)-ren1
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MIC94073YMT-TR Details

  • Manufacturer Part Number:

    MIC94073YMT-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    4

  • Manufacturer Package Code:

    UDFN-4

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-XDSO-N4

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC4,.06,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.6 mm

  • Supply Current-Max (Isup):

    0.005 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    1.2 mm

MIC94073YMT-TR Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink if necessary. The datasheet provides some guidelines, but a more detailed application note or a thermal simulation tool can help optimize the design.
  • In addition to following the recommended operating conditions, ensure that the device is properly decoupled, and the power supply is stable and clean. Also, consider the thermal derating and adjust the design accordingly.
  • The quiescent current affects the overall power consumption of the system. Consider the device's quiescent current in your power budget calculations, and ensure that it meets your system's power requirements.
  • Use an oscilloscope to monitor the output voltage, and check for any signs of oscillation or instability. Verify that the input voltage is within the recommended range, and that the output capacitor is properly sized and selected.
  • Follow proper PCB layout and routing guidelines to minimize EMI. Ensure that the device is properly decoupled, and consider adding EMI filters or shielding if necessary. Also, comply with relevant EMC standards and regulations.

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MIC94073YMT-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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