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MIC94161YCS-TR - Microchip

Description: MICROCHIP - MIC94161YCS-TR - Power Load Distribution Switch IC, Active High, 1 Output, 5.5 V in, 3 A, 0.0145 ohm, WLCSP-6

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PCB Footprints
MIC94161YCS-TR - Microchip PCB footprint - BGA - BGA - 6 BALL WLCSP 1.5 X 1.0 mm
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3D Models
MIC94161YCS-TR - Microchip  - 3D model - BGA - 6 BALL WLCSP 1.5 X 1.0 mm
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MIC94161YCS-TR Details

  • Manufacturer Part Number:

    MIC94161YCS-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA, BGA6,2X3,20

  • Pin Count:

    6

  • Manufacturer Package Code:

    WLCSP-6

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    2 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Additional Feature:

    OVER VOLTAGE PROTECTION

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load switch

  • JESD-30 Code:

    R-XBGA-B6

  • JESD-609 Code:

    e1

  • Length:

    1.5 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA6,2X3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    0.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +4.75V

  • Width:

    1 mm

MIC94161YCS-TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The MIC94161YCS-TR has an exposed thermal pad that should be connected to the ground plane.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 125°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the PCB is designed to minimize thermal resistance.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the VIN pin as possible.
  • Use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and use a common-mode choke to reduce EMI. Also, ensure that the PCB is designed to minimize radiation and conduction of EMI.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for output filtering. The capacitor should be placed as close to the VOUT pin as possible.

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MIC94161YCS-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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