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MIC94305YMT-TR - Microchip

Description: Power Switch ICs - Power Distribution 500mA Switch with Ripple Blocker Technology

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MIC94305YMT-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 6-Lead TDFN 1.6 mm x 1.6 mm Package
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MIC94305YMT-TR - Microchip  - 3D model - Small Outline No-lead - 6-Lead TDFN 1.6 mm x 1.6 mm Package
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MIC94305YMT-TR Details

  • Manufacturer Part Number:

    MIC94305YMT-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TDFN-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    UDFN-6

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Built-in Protections:

    THERMAL

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1.6 mm

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    0.725 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.06,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-on Time:

    150 µs

  • Width:

    1.6 mm

MIC94305YMT-TR Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink. The datasheet provides some guidelines, but a more detailed application note or a thermal simulation tool can help optimize the design.
  • Follow the power-up sequence and configuration guidelines in the datasheet. Ensure the input voltage is within the recommended range, and the device is properly configured using the EN and SYNC pins.
  • Operating the device beyond the recommended conditions can lead to reduced reliability, increased power consumption, and potential damage to the device. Always operate within the specified temperature, voltage, and current ranges.
  • Use a systematic approach to troubleshoot: check the power supply, clock signal, and configuration. Use oscilloscopes or logic analyzers to monitor signals, and consult the datasheet and application notes for guidance.
  • Yes, follow proper EMI/EMC design practices, such as using a solid ground plane, decoupling capacitors, and shielding. Ensure the device is placed away from noise sources and antennas.

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MIC94305YMT-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image MIC94305YMT-T5 Microchip Technology Inc

Buffer/Inverter Based Peripheral Driver, 0.725A, CMOS, PDSO6