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MICRF113YM6-TR - Microchip

Description: RF Transmitter 300 to 450MHz ASK +10dBm, 1.8V to 3.6V Transmitter

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MICRF113YM6-TR - Microchip - PCB symbol
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PCB Footprints
MICRF113YM6-TR - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - MICRF113YM6-TR-1
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MICRF113YM6-TR - Microchip - 3D model - SOT23 (6-Pin) - MICRF113YM6-TR-1
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MICRF113YM6-TR Details

  • Manufacturer Part Number:

    MICRF113YM6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT-23-6

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.6 mm

MICRF113YM6-TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces short and away from noisy digital signals. Use a common mode filter or a pi-filter to reduce EMI.
  • Implement a robust error correction mechanism, such as CRC or checksum, and use a retry mechanism to retransmit corrupted packets. Also, consider using a spread spectrum technique like frequency hopping or direct sequence spread spectrum to minimize interference.
  • The maximum transmission distance depends on the environment, antenna design, and transmission power. In ideal conditions, the MICRF113YM6-TR can achieve a range of up to 100 meters. However, this can be affected by obstacles, interference, and antenna orientation.
  • Use the device's low-power modes, such as sleep or standby, when not transmitting or receiving. Optimize the transmission protocol to minimize the number of transmissions and use a low-power oscillator. Consider using a power amplifier with a high power-added efficiency to reduce power consumption.
  • The antenna design should consider the operating frequency, impedance matching, and radiation pattern. A quarter-wave monopole or a dipole antenna is suitable for the MICRF113YM6-TR. Ensure the antenna is properly matched to the device's output impedance to minimize reflections and maximize transmission efficiency.

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MICRF113YM6-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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