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MICROFJ-60035-TSV-TR1 - onsemi

Description: High-density microcells; Optimized for high-performance timing applications, such as ToF-PET; Ultra-low dark count rates of 50 kHz/mm2 typical; J-Series sensors feature ON Semiconductor's unique 'fast output' terminal; Exceptional breakdown voltage uniformity of ±250 mV; Temperature stability of 21.5 mV/°C; 3 mm, 4 mm and 6 mm sensor sizes; Available in a reflow solder compatible TSV chip-scale package; Bias voltage of <30 V

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MICROFJ-60035-TSV-TR1 - onsemi - PCB symbol
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MICROFJ-60035-TSV-TR1 - onsemi PCB footprint - Other - Other - MICROFJ-60035-TSV-TR1-5
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MICROFJ-60035-TSV-TR1 - onsemi - 3D model - Other - MICROFJ-60035-TSV-TR1-5
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MICROFJ-60035-TSV-TR1 Details

  • Manufacturer Part Number:

    MICROFJ-60035-TSV-TR1

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    ODCSP-36

  • Manufacturer Package Code:

    570CP

  • Country Of Origin:

    Thailand

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.4

  • Configuration:

    COMPLEX

  • Dark Current-Max:

    12000 nA

  • Infrared Range:

    NO

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    AVALANCHE PHOTODIODE

  • Packing Method:

    TR

  • Peak Wavelength:

    420 nm

  • Reverse Breakdown Voltage-Min:

    24.2 V

  • Shape:

    SQUARE

  • Size:

    6.07 mm

  • Surface Mount:

    YES

MICROFJ-60035-TSV-TR1 Frequently Asked Questions (FAQs)

  • A good PCB layout should prioritize thermal dissipation, with a solid ground plane and thermal vias. A heat sink or thermal pad can be used to dissipate heat. Consult onsemi's application notes for specific guidance.
  • Follow onsemi's guidelines for PCB layout, component placement, and shielding. Use a metal shield or Faraday cage to enclose the device, and ensure proper grounding and decoupling.
  • The device is rated for operation up to 150°C. However, reliability and lifespan will depend on specific application conditions. Consult onsemi's reliability reports and application notes for guidance on derating and stress analysis.
  • The device is rated for 600V and 35A. However, it's essential to consider derating, thermal management, and overcurrent protection to ensure safe operation. Consult onsemi's application notes and datasheet for specific guidance.
  • Use onsemi's troubleshooting guides and application notes to identify common failure modes, such as overheating, overvoltage, or overcurrent. Perform visual inspections, and use diagnostic tools like oscilloscopes and logic analyzers to identify issues.

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MICROFJ-60035-TSV-TR1 Overview

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