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MIMX8DL1AVNFZAB - NXP

Description: Microprocessor IC - 388-LBGA (15x15)

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MIMX8DL1AVNFZAB - NXP PCB footprint - Other - Other - SOT2007-1
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MIMX8DL1AVNFZAB - NXP  - 3D model - Other - SOT2007-1
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MIMX8DL1AVNFZAB Details

  • Manufacturer Part Number:

    MIMX8DL1AVNFZAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCPBGA-388

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • JESD-30 Code:

    S-PBGA-B388

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    388

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA388,35X35,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX8DL1AVNFZAB Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for MIMX8DL1AVNFZAB is -40°C to 105°C. However, it's essential to note that the device can operate at a wider temperature range, but with reduced performance and reliability.
  • To optimize power consumption on MIMX8DL1AVNFZAB, you can use various techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS). Additionally, you can use the device's power management features, such as the Power Management Unit (PMU) and the Low Power Mode (LPM), to reduce power consumption.
  • The maximum clock frequency supported by MIMX8DL1AVNFZAB is 1.6 GHz for the Cortex-A35 core and 650 MHz for the Cortex-M4 core. However, the actual clock frequency may vary depending on the specific use case and system design.
  • To configure the DDR memory interface on MIMX8DL1AVNFZAB, you need to set the DDR clock frequency, configure the DDR timing parameters, and enable the DDR controller. You can use the device's DDR controller registers and the NXP-provided DDR initialization code to configure the DDR memory interface.
  • The MIMX8DL1AVNFZAB supports up to 4GB of RAM and 128MB of flash memory. However, the actual amount of memory supported may vary depending on the specific system design and configuration.

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MIMX8DL1AVNFZAB Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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