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MIMX8DL1CVNFZAB - NXP

Description: Microprocessors - MPU i.MX 8DualXLite, Dual A35 core, Two @ 1.2 GHz, 264 MHz 15 mm x 15 mm, 0.56 and 0.8 mm mixed pitch, FCPBGA (bare die)

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Symbol
MIMX8DL1CVNFZAB - NXP - PCB symbol
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PCB Footprints
MIMX8DL1CVNFZAB - NXP PCB footprint - Other - Other - FBGA388 (SOT2007-1)_2023
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3D Models
MIMX8DL1CVNFZAB - NXP - 3D model - Other - FBGA388 (SOT2007-1)_2023
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MIMX8DL1CVNFZAB Details

  • Manufacturer Part Number:

    MIMX8DL1CVNFZAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-388

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • JESD-30 Code:

    S-PBGA-B388

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    388

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA388,35X35,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX8DL1CVNFZAB Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the VDD_HIGH first, followed by VDD_LOW, and then the core voltage (VDD_CORE). This ensures that the internal voltage regulators are properly enabled and the device boots up correctly.
  • The DDR memory interface on the MIMX8DL1CVNFZAB can be configured using the DDR Controller (DDRC) registers. The DDRC is programmed through the Memory Controller (MC) registers, which are accessed through the AHB bus. The recommended configuration is to use the DDR4 mode with a clock frequency of 1600 MT/s.
  • The maximum operating temperature range for the MIMX8DL1CVNFZAB is -40°C to 105°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • Secure boot on the MIMX8DL1CVNFZAB can be implemented using the Boot ROM and the Fuse Box. The Boot ROM verifies the authenticity of the boot loader and the operating system, while the Fuse Box stores the secure boot keys and configuration. The recommended approach is to use the NXP-provided secure boot tools and libraries to generate the secure boot images and configure the Fuse Box.
  • The maximum clock frequency for the Cortex-A35 core on the MIMX8DL1CVNFZAB is 1.6 GHz. However, the actual clock frequency may vary depending on the specific use case, thermal conditions, and power consumption requirements.

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MIMX8DL1CVNFZAB Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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