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MIMX8ML8CVNKZAB - NXP

Description: NXP - MIMX8ML8CVNKZAB - Microprocessor, i.MX 8M Plus Quad, 1.8GHz, 32bit, -40 °C to 105 °C, FCBGA

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Symbol
MIMX8ML8CVNKZAB - NXP - PCB symbol
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PCB Footprints
MIMX8ML8CVNKZAB - NXP PCB footprint - BGA - BGA - SOT2047-1
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3D Models
MIMX8ML8CVNKZAB - NXP - 3D model - BGA - SOT2047-1
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MIMX8ML8CVNKZAB Details

  • Manufacturer Part Number:

    MIMX8ML8CVNKZAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-548

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B548

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    548

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA548,29X29,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.481 mm

  • Supply Voltage-Max:

    1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX8ML8CVNKZAB Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the VDD_HIGH first, followed by VDD_SOC, and then the other power rails. This ensures that the internal voltage regulators are powered up in the correct order.
  • The DDR memory interface on the MIMX8ML8CVNKZAB is configured using the DDRPHY register settings. The recommended settings can be found in the NXP application note AN12115.
  • The maximum operating temperature range for the MIMX8ML8CVNKZAB is -40°C to 105°C. However, the device can be operated at temperatures above 105°C for short periods of time, but this may affect its reliability and lifespan.
  • Secure boot on the MIMX8ML8CVNKZAB can be implemented using the High-Assurance Boot (HAB) mechanism. This involves generating a secure boot image using the NXP Code Signing Tool and configuring the boot mode pins accordingly.
  • The maximum clock frequency supported by the MIMX8ML8CVNKZAB is 1.6 GHz. However, the actual clock frequency may be limited by the specific use case and thermal design.

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MIMX8ML8CVNKZAB Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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