MIMX8MQ5DVAJZAB - NXP

MIMX8MQ5DVAJZAB Details

• Manufacturer Part Number:

  MIMX8MQ5DVAJZAB

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FBGA-621

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  18 Weeks

• Date Of Intro:

  2018-10-17

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  7

• JESD-30 Code:

  S-PBGA-B621

• Length:

  17 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  621

• Operating Temperature-Max:

  95 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA621,25X25,25

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Screening Level:

  TS 16949

• Seated Height-Max:

  2.18 mm

• Supply Voltage-Max:

  1.05 V

• Supply Voltage-Min:

  0.99 V

• Supply Voltage-Nom:

  1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver (Sn/Ag)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  17 mm

• uPs/uCs/Peripheral ICs Type:

  SoC